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interplast

Motherboard

Made of expanded polystyrene with polyethylene film and a special configuration on its surface (plugs).
The form plate offers heat insulation, sound insulation and moisture protection against the cement mortar coating.
It ensures perfect support of the pipe and its covering by the coating cement.
It allows maintaining the circuit spacing in steps of 7.5cm and 15cm.
The piece dimensions are 1350 x 750 mm2 and are available in boxes of 12 pcs.
The compressive strength of the form plate is 150kPa according to EN 826.
The total height of the form plate (cap + base) is 4.5cm.
The coefficient of thermal conductivity is 0.034 w/mK and the thermal resistance is 0.40m2k/W.

Motherboard

Made of expanded polystyrene with removable EPS and special configuration on its surface (plugs).
The form plate offers heat insulation, sound insulation and moisture protection against the cement mortar coating.
It ensures perfect support of the pipe and its covering by the coating cement.
It allows maintaining the circuit spacing in 10cm and 15cm increments.
The piece dimensions are 1450 x 850 mm2 and are available in boxes of 10 pcs.
The compressive strength of the form plate is 150kPa according to EN 826.
The total height of the form plate (cap + base) is 4.3cm.
The coefficient of thermal conductivity is 0.034 w/mK and the thermal resistance is 0.55m2k/W.

Motherboard
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Locations

Brass products Factory
Kefalovrisou 23, 13 677 st. Monopati, Acharnai, Athens, Greece
Plastic factory
Industrial area of Komotini, 69100 Komotini, Greece
Offices / Exhibition
El. Venizlou 9B, 57 001 Thermi Thessaloniki, Greece